1 产品类型
刚性板 Rigid board
挠性板 flexible board
刚挠板 rigid-flex board
印刷电路 printed circuit board
金属基板 metal base PCB
铝基板 Aluminum base printed board
铜基板 Copper base printed board
高频板 High Frequency PCB
盲孔板 Blind board
埋孔板 buried board
裸板 bare board
样板 Quick turn prototype
批量订单 mass production
2 物料描述
Copper clad laminate (CCL)(覆铜板) (core)
Prepreg(半固化片)
Epoxy resin(环氧树脂)
Non-conductive epoxy resin(非导电树脂)
Conductive epoxy resin (导电树脂)
Copper foil(铜箔)
Dielectric (介质)
Ptfe (Polytetralluoetylene) Teflon(聚四氟乙烯)
Dielectric constant(介电常数)
3 设备描述
Impedance control testsystem(阻抗控制检测仪)
Flying Probe test FPT(飞针检测仪)
Fixture test (夹具测试)
Automatic optical instrument AOI (自动光学检测仪)
4 表面工艺描述
沉金 Immersion Gold =Chemical Gold=Immersion Ni/Au=electroless Gold
Plating ENIG= electroless Nickel
沉锡(IMSn):Immersion Sn
沉银(IMAg):Immersion Ag
有机保焊膜(OSP):Organic SolderabilityPreservatives=Entek 106
电镀金electroplated gold plating =Electrical Goldplating
金手指Gold Fingers=Edge Connector Plating=Tab connector
无铅喷锡Lead Free HASL=HASL LF=HASL for Pb Free=SN100C=RoHS HAL
有铅喷锡(HASL/HAL)HAL=Hot Air Leveling HASL=Hot Air Solder Leveling
Sn/Pb(63/36) Tin-Lead solder
裸铜Bare copper Blank Copper
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